ANSYS Icepak & SpaceClaim: Fast Electronics Cooling CFD Workflow

Added:

Model Prep
Object Setup
Fan Selection
Heatsink Add
Setup Solve
Param Setup
Optim Setup
DOE Run
Tradeoff Find
Final Design

Model Prep

0:00
Playing Section
  • 1

    Clean and simplify complex CAD geometry using SpaceClaim tools.

  • 2

    Convert components like PCBs and fans into recognized Icepak objects.

  • 3

    Use fill and fit operations to remove unnecessary details.

Fundamental principles of heat transfer, specifically conduction, convection (natural and forced), and radiation in electronic systems.
Basic Computational Fluid Dynamics (CFD) concepts, including governing equations, boundary conditions, and the importance of mesh generation.
Introduction to 3D CAD modeling concepts and direct modeling workflows, as utilized in geometry preparation tools like SpaceClaim.
Understanding of electronics packaging components, such as PCBs, integrated circuits (ICs), heat sinks, thermal interface materials (TIMs), and fans.
Advanced meshing strategies in ANSYS Icepak, including non-conformal meshing, multi-level meshing, and conducting mesh independence studies.
Transient thermal analysis to simulate time-dependent heating behaviors, duty cycles, and thermal throttling in electronics.
Multiphysics co-simulation, such as coupling ANSYS Icepak with ANSYS Mechanical for thermal-structural stress and warpage analysis.
Design of Experiments (DoE) and parametric optimization using ANSYS DesignXplorer to automatically optimize heat sink geometries and fan placement.
Experimental validation methodologies, including correlating CFD simulation results with physical wind tunnel testing and infrared thermography.
61K views522likes19:38@SingularityEngineeringLLCOriginal Release: 2018-12-05

This video demonstrates how to efficiently perform electronics cooling simulations using ANSYS SpaceClaim for CAD geometry preparation and ANSYS Icepak for thermal analysis, enabling rapid design exploration and optimization through parametric modeling of heat sinks, fans, and grills to evaluate trade-offs between cooling performance and component costs.