Designing Custom 3D Printed Enclosures: A Guide

Added:

Design Basics
Standoff Strategy
Print Optimize
PCB Inset
Print Orient
Efficiency Gains

Design Basics

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Playing Section
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    Focuses on benefits of custom 3D printed enclosures for PCB protection.

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    Highlights key challenge: designing for 3D printing, not injection molding.

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    Identifies standoff placement as the starting point for the design process.

Basic proficiency in 3D Computer-Aided Design (CAD) software, such as Autodesk Fusion 360, SolidWorks, or Onshape.
Fundamental understanding of 3D printing technologies, specifically Fused Deposition Modeling (FDM), and how layer-by-layer fabrication works.
Concept of dimensional tolerance and clearance fits, which are essential for ensuring physical parts assemble together properly.
Basic familiarity with electronic hardware components, such as PCBs (Printed Circuit Boards), ports, switches, and power connectors.
Advanced enclosure fastening techniques, such as designing snap-fit joints, living hinges, and incorporating brass threaded inserts.
Thermal management and cooling design, including the strategic placement of ventilation slots, heat sinks, and active cooling fans.
Designing for Ingress Protection (IP) ratings, which involves integrating gaskets and seals to protect electronics from dust and moisture.
Design for Manufacturing (DFM) principles for scaling production, specifically transitioning a 3D-printed prototype to injection molding.
61K views1.6Klikes11:59@slant3dOriginal Release: 2023-03-31

When designing custom 3D printed electrical enclosures for mass production, prioritize structural integrity by making standoffs as thick as possible and using chamfers instead of fillets to eliminate orientation requirements and prevent breakage; optimize manufacturability by avoiding flat printing orientations, minimizing bed contact through chamfered corners, eliminating sharp internal edges, and considering PCB inset designs over traditional standoffs to reduce support material and improve print quality while enabling easier assembly and ESD-safe material options.