Multilayer Soft Lithography for Microfluidic Devices | Stanford Foundry

Added:

Mold Making
Develop & Bake
PDMS Mixing
Layer Bonding
Final Bond
Device Test

Mold Making

0:25
Playing Section
  • 1

    Explains two-layer mold creation using SU-8 and SPR resists.

  • 2

    Describes spin coating, soft baking, and UV exposure steps.

  • 3

    Details mask types: transparency for 10µm, chrome for sub-1µm.

Fundamentals of microfluidic physics, specifically laminar flow, diffusion, and low Reynolds number hydrodynamics.
Basic photolithography principles, including the use of photoresists (such as SU-8), UV exposure, and silicon wafer patterning to create molds.
Material properties of Polydimethylsiloxane (PDMS), such as its elasticity, gas permeability, and optical transparency.
The chemical principles of elastomer curing, specifically heat-induced polymer cross-linking and mixing ratios.
Design and operation of active microfluidic components, such as pneumatic microvalves and peristaltic pumps.
Surface modification techniques, such as oxygen plasma treatment, to alter PDMS hydrophobicity and enable permanent bonding to glass.
Applications in Bio-MEMS and Organs-on-a-Chip, including cell culture, shear stress control, and tissue engineering.
High-throughput droplet microfluidics for applications like digital PCR, single-cell analysis, and nanoparticle synthesis.
Transitioning from PDMS prototyping to mass-manufacturing technologies, such as thermoplastic injection molding and hot embossing.
20.3K views156likes11:49@emrear78Original Release: 2012-01-11

Multilayer soft lithography is a microfabrication technique for creating multi-layer microfluidic devices, involving sequential steps: (1) Mold-making using photolithography with negative resist (SU-8) for control layers and positive resist (SPR) for flow layers, where resist thickness determines channel height; (2) PDMS replica fabrication by mixing base polymer with cross-linker (5:1 ratio for control layers, 20:1 for thin layers), degassing to remove bubbles, and baking; (3) Layer bonding through thermal annealing at 80°C where cross-linker diffusion creates permanent bonds between layers; (4) Final glass-PDMS bonding using oxygen plasma treatment. This technique enables precise control over microfluidic channel dimensions and complex device architectures.